| 000 | 00846nam a22002177a 4500 | ||
|---|---|---|---|
| 005 | 20251004141516.0 | ||
| 008 | 251004b |||||||| |||| 00| 0 eng d | ||
| 020 |
_a9780819465764 _qpbk. |
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| 041 | _aeng | ||
| 082 |
_a621.381 _bHAR |
||
| 100 | _aHartzell, Allyson L. ; Ramesham, Rajeshuni | ||
| 245 |
_aReliability, Packaging, Testing, And Characterization Of Mems/moems Vi : 23-24 January, 2007, San Jose, California, Usa _c/ edited by Allyson L. Hartzell, Rajeshuni Ramesham |
||
| 250 | _a1st ed. | ||
| 260 |
_aBellingham _bSpie _cc2007 |
||
| 300 |
_aix, (various pagings) _b: ill. _c; 29 cm. |
||
| 490 |
_aProceedings of SPIE--the International Society for Optical Engineering, _vv. 6463 |
||
| 504 | _aindex | ||
| 650 | _aMicroelectromechanical Systems Reliability Congresses | ||
| 650 | _aMicroelectronic packaging | ||
| 942 | _cREF | ||
| 999 |
_c590779 _d590779 |
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