000			00972nam a2200277Ia 4500
008			191130s2002##################000#0#eng##
020			_a9781402073304
022			_a2002038928
040			_aACL _cACL
082			_a621.381046 MAD
100			_aMadenci, Erdogan
245			_aFatigue life prediction of solder joints in electronic packages with ANSYS _cErdogan Madenci, Ibrahim Guven, Bahattin Kilic
260			_aDordrecht ; Boston _bKluwer Academic Publishers _c2002
300			_axx, 185 p. : ill. ; 25 cm
500			_aIncludes bibliographical references and index
650			_aANSYS (Computer system)
650			_aElectronic packaging - Computer-aided design
650			_aMetals - Fatigue
650			_aService life (Engineering) - Forecasting
650			_aSolder and soldering - Quality control
700			_aGuven, Ibrahim
700			_aKilic, Bahattin
990			_a29926e68ac10000c6d21426712d610c7
991			_a147323
999			_c182114 _d182114