000 01423nam a2200277Ia 4500
008 191130s2004##################000#0#eng##
020 _a9780819452924
022 _a2004303081
040 _aACL
_cACL
082 _a621.381 LIE
245 _aDesign and process integration for microelectronic manufacturing II [sic] : 26-27 February 2004, Santa Clara, California, USA
_cLars W. Liebmann, chair/editor ; sponsored ... by SPIE--the International Society for Optical Engineering ; cooperating organizations, SEMI--Semiconductor Equipment and Materials International [and] International SEMATECH
260 _aBellingham, Wash
_bSPIE
_cc2004
300 _axxviii, 302 p. : ill., ports. ; 28 cm
500 _aIncludes bibliographical references and index
650 _aIntegrated circuits - Defects - Analysis - Congresses
650 _aIntegrated circuits - Design and construction - Congresses
650 _aMicroelectronics industry - Quality control - Congresses
650 _aQuality control - Congresses
650 _aSemiconductor wafers - Defects - Analysis - Congresses
650 _aSemiconductors - Design and construction - Congresses
700 _aLiebmann, Lars W
710 _aInternational SEMATECH, Semiconductor Equipment and Materials International, Society of Photo-optical Instrumentation Engineers
990 _ac99f5a90ac10000c63dbef5871682d84
991 _a360069
999 _c147488
_d147488