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	1.		MCM C/mixed technologies and thick film sensors edited by W. Kinzy Jones ... [et al.] by Harsanyi, Gabor Jones, W. Kinzy Kurzweil, Karel NATO Advanced Research Institute on Ceramic/Mixed Mode Multi-Chip Modules (MCM) (1994 : Islamorada, Fla.) Publication details: Dordrecht ; Boston Kluwer Academic Publishers 1995 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381146 JON.
	2.		Multi-chip module test strategies edited by Yervant Zorian by Zorian, Yervant Publication details: Deventer, The Netherlands ; Boston, MA Kluwer 1997 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 ZOR.
	3.		Thermal management handbook : for electronic assemblies Jerry Sergent, Al Krum by Sergent, Jerry E Krum, Al Publication details: New York McGraw-Hill 1998 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381 SER.
	4.		Foldable flex and thinned silicon multichip packaging technology edited by John W. Balde by Balde, John W Publication details: Dordrecht ; Boston Kluwer Academic Publishers 2003 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 BAL.
	5.		Hybrid assemblies and multichip modules Fred W. Kear by Kear, Fred W Publication details: New York Marcel Dekker 1993 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.3815 KEA.
	6.		Introduction to system-on-package (SOP) : miniaturization of the entire system Rao R. Tummala, Madhavan Swaminathan by Tummala, Rao R Swaminathan, Madhavan Publication details: New York McGraw-Hill 2008 Availability: Items available for loan: Anna Centenary Library (1)Call number: 620.0011 TUM.

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