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	1.		Wire bonding in microelectronics George G. Harmon by Harman, George G Edition: 3rd ed Publication details: New York McGraw-Hill 2010 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.3815 HAR.
	2.		Electronic packaging for high reliability ; low cost electronics edited by Rao Tummala ... [et al.] by Beavic, Darko Jones, W. Kinzy Kosec, Marija Publication details: Dordrecht ; Boston Kluwer Academic 1999 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 TUM.
	3.		Guidebook for managing silicon chip reliability Michael G. Pecht, Riko Radojcic, Gopal Rao by Pecht, Michael Radojcic, Riko Rao, Gopal K Publication details: Boca Raton, FL CRC Press 1999 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.3815 PEC.

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