Your search returned 2 results.

Results
	1.		Proceedings : IMAPS conference and exhibition on ceramic interconnect technology, the next generation : April 7-9 2003, the Westin Hotel, Denver, Colorado sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff] Publication details: Washington, DC IMAPS 2003 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 IMA.
	2.		Advanced Si-based ceramics and composites : proceedings of the international symposium on new frontier of advanced Si-based ceramics and composites (ISASC 2004) held in Gyeongju, Korea, June 20-23, 2004 edited by Hai-Doo Kim, Hua-Tay Lin and Michael J. Hoffmann by Hoffmann, Michael J Kim, Hai-Doo Lin, Hua-Tay Center for Advanced Materials Processing, Hanʾguk Seramik Hakhoe, International Symposium on New Frontier of Advanced Si-Based Ceramics and Composites (2004 : Gyeongju, Korea), Korea Institute of Machinery & Materials Publication details: Stafa-Zurich, Switzerland ; Enfield, NH Trans Tech Publications Ltd 2005 Availability: Items available for loan: Anna Centenary Library (1)Call number: 620.11 KIM.

Refine your search