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1.
Wire bonding in microelectronics George G. Harmon by
Edition: 3rd ed
Publication details: New York McGraw-Hill 2010
Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.3815 HAR.

2.
Failure modes and mechanisms in electronic packages Puligandla Viswanadham and Pratap Singh by
Publication details: London Chapman & Hall 1998
Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 VIS.

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