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	1.		Proceedings : 1999 international conference on high density packaging and MCMs, April 6-9, 1999, the Adam's mark Hotel, Denver, Colorado by IMAPS Publication details: Bellingham, WA SPIE - Proceeding 1999 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381091724 SPI.
	2.		Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media by CMP Media, International Conference on High-Density Interconnect and Systems Packaging (2001 : Santa Clara, Calif.), International Microelectronics and Packaging Society, Society of Photo-optical Instrumentation Engineers Publication details: Bellingham, WA SPIE c2001 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 SPI.
	3.		Proceedings : IMAPS conference and exhibition on ceramic interconnect technology, the next generation : April 7-9 2003, the Westin Hotel, Denver, Colorado sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff] Publication details: Washington, DC IMAPS 2003 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.381046 IMA.
	4.		Proceedings, 2000 international symposium on microelectronics : September 20-22, 2000, Hynes Convention Center, Boston, MAssachusetts IMAPS Publication details: Bellingham, WA SPIE 2000 Availability: Items available for loan: Anna Centenary Library (1)Call number: 621.3817 IMA.

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