MCM C/mixed technologies and thick film sensors 
edited by W. Kinzy Jones ... [et al.] 
 - Dordrecht ; Boston  Kluwer Academic Publishers  1995 
 - x, 318 p. : ill. ; 25 cm 
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780792334606 
<br/><br/><label>ISSN: </label>95014221 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging - Congresses<br/>Multichip modules (Microelectronics) - Congresses<br/>Thick film circuits - Congresses
<br/><br/><label>Dewey Class. No.: </label>621.381146 JON