TY  - BOOK
AU  - Hartzell, Allyson L. ; Ramesham, Rajeshuni 
TI  - Reliability, Packaging, Testing, And Characterization Of Mems/moems Vi : 23-24 January, 2007, San Jose, California, Usa
T2  - Proceedings of SPIE--the International Society for Optical Engineering, 
SN  - 9780819465764
U1  - 621.381 
PY  - 2007///
CY  - Bellingham
PB  - Spie
KW  - Microelectromechanical Systems Reliability Congresses
KW  - Microelectronic packaging
N1  - index
ER  -