Hartzell, Allyson L. ; Ramesham, Rajeshuni  <br/><br/>
Reliability, Packaging, Testing, And Characterization Of Mems/moems Vi : 23-24 January, 2007, San Jose, California, Usa 
/ edited by Allyson L. Hartzell,  Rajeshuni Ramesham 
 - 1st ed. 
 - Bellingham  Spie  c2007 
 - ix, (various pagings)  : ill.  ; 29 cm. 
 - Proceedings of SPIE--the International Society for Optical Engineering,   v. 6463 .
<br/><br/>Includes index 
<br/><br/><label>ISBN: </label>9780819465764 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical Systems Reliability Congresses<br/>Microelectronic packaging
<br/><br/><label>Dewey Class. No.: </label>621.381  / HAR