TY  - BOOK
ED  - CMP Media, International Conference on High-Density Interconnect and Systems Packaging (2001 : Santa Clara, Calif.), International Microelectronics and Packaging Society, Society of Photo-optical Instrumentation Engineers
TI  - Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
SN  - 9780819441393
SN  - 200227750
U1  - 621.381046 SPI 
PY  - 2001///
CY  - Bellingham, WA
PB  - SPIE
KW  - Integrated circuits - Design and construction - Congresses
KW  - Microelectromechanical systems - Congresses
KW  - Microelectronic packaging - Congresses
N1  - Includes bibliographical references and index
ER  -