Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California 
sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media 
 - Bellingham, WA  SPIE  c2001 
 - x, 380 p. : ill. ; 28 cm 
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780819441393 
<br/><br/><label>ISSN: </label>2002277508 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Integrated circuits - Design and construction - Congresses<br/>Microelectromechanical systems - Congresses<br/>Microelectronic packaging - Congresses
<br/><br/><label>Dewey Class. No.: </label>621.381046 SPI