TY  - BOOK
AU  - Lau, John H
AU  - Aibin, Yu
AU  - Lee, Cheng Kuo
AU  - Premachandran, C. S
TI  - Advanced MEMS packaging
SN  - 9780071626231
SN  - 200904045
U1  - 621.381046 LAU 
PY  - 2010///
CY  - New York
PB  - McGraw Hill
KW  - Microelectromechanical systems
KW  - Microelectronic packaging
N1  - Includes bibliographical references and index
ER  -