Lau, John H <br/><br/>
Advanced MEMS packaging 
John H. Lau ... [et al.] 
 - New York  McGraw Hill  c2010 
 - xxiii, 552 p. : ill. ; 24 cm 
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780071626231 
<br/><br/><label>ISSN: </label>2009040456 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems<br/>Microelectronic packaging
<br/><br/><label>Dewey Class. No.: </label>621.381046 LAU