Photonics packaging and integration VI : 25-26 January, 2006, San Jose, California, USA 
Allen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering 
 - Bellingham, WA  SPIE  c2006 
 - 1 v. (various pagings) : ill. ; 28 cm 
<br/><br/> Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration. Includes bibliographical references and author index 
<br/><br/><label>ISBN: </label>9780819461681 
<br/><br/><label>ISSN: </label>2006281946 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging - Congresses<br/>Optical interconnects - Congresses<br/>Optoelectronic devices - Design and construction - Congresses<br/>Photonics - Congresses
<br/><br/><label>Dewey Class. No.: </label>621.36 EAR