TY  - BOOK
AU  - Chen, Ray T
AU  - Heyler, Randy A
ED  - Society of Photo-optical Instrumentation Engineers
TI  - Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA
SN  - 9780819452665
SN  - 200430410
U1  - 621.36 HEY 
PY  - 2004///
CY  - Bellingham, WA
PB  - SPIE
KW  - Microelectronic packaging - Congresses
KW  - Optical interconnects - Congresses
KW  - Optoelectronic devices - Design and construction - Congresses
KW  - Photonics - Congresses
N1  - Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration Includes bibliographical references and index
ER  -