TY  - BOOK
AU  - Schwizer, J
AU  - Brand, O
AU  - Mayer, M
TI  - Force sensors for microelectronic packaging applications
SN  - 9783540221876
SN  - 200411061
U1  - 621.381046 SCH 
PY  - 2004///
CY  - Berlin
PB  - Springer
KW  - Microelectronic packaging
KW  - Wire bonding (Electronic packaging)
N1  - Includes bibliographical references (p. [165]-174) and index
ER  -