Foldable flex and thinned silicon multichip packaging technology 
edited by John W. Balde 
 - Dordrecht ; Boston  Kluwer Academic Publishers  2003 
 - xix, 338 p. : ill. ; 25 cm 
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780792376767 
<br/><br/><label>ISSN: </label>2002034095 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Chip scale packaging<br/>Flexible printed circuits<br/>Microelectronic packaging<br/>Multichip modules (Microelectronics)
<br/><br/><label>Dewey Class. No.: </label>621.381046 BAL