TY  - BOOK
AU  - Madenci, Erdogan
AU  - Guven, Ibrahim
AU  - Kilic, Bahattin
TI  - Fatigue life prediction of solder joints in electronic packages with ANSYS
SN  - 9781402073304
SN  - 200203892
U1  - 621.381046 MAD 
PY  - 2002///
CY  - Dordrecht ; Boston
PB  - Kluwer Academic Publishers
KW  - ANSYS (Computer system)
KW  - Electronic packaging - Computer-aided design
KW  - Metals - Fatigue
KW  - Service life (Engineering) - Forecasting
KW  - Solder and soldering - Quality control
N1  - Includes bibliographical references and index
ER  -