Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia 
Paul D. Frnazon, chair/editor ; sponsored and published by SPIE--the International Society for Optical Engineering ; cosponsored by U.S. Air Force Office of Scientific Research, Asian Office of Aerospace Research and Development ... [et al.] ; cooperating organization IEEE South Australia Section 
 - Bellingham, Wash  SPIE  c2001 
 - ix, 322 p. : ill. ; 28 cm 
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780819443236 
<br/><br/><label>ISSN: </label>2002279639 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectromechanical systems - Design and construction - Congresses<br/>Microelectronic packaging - Congresses
<br/><br/><label>Dewey Class. No.: </label>621.381 FRA