TY  - BOOK
AU  - Klopfenstein, Alan G
AU  - Rymaszewski, Eugene J
AU  - Tummala, Rao R
TI  - Microelectronics packaging handbook : subsystem packaging
SN  - 9780412084515
SN  - 96037907
U1  - 621.381046 TUM 
PY  - 1997///
CY  - Dordrecht ; Boston
PB  - Kluwer Academic Publishers
KW  - Microelectronic packaging - Handbooks, manuals, etc
N1  - Includes bibliographical references and index
ER  -