Microelectronics packaging handbook : subsystem packaging 
edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein 
 - 2nd ed 
 - Dordrecht ; Boston  Kluwer Academic Publishers  1997 
 - 3 v. : ill. ; 24 cm 
<br/><br/> Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9780412084515 
<br/><br/><label>ISSN: </label>96037907 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging - Handbooks, manuals, etc
<br/><br/><label>Dewey Class. No.: </label>621.381046 TUM