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MEMS/MOEMS packaging : concepts, designs, materials, and processes Ken Gilleo
Publication details: New York McGraw-Hill 2005Description: xiii, 220 p. : ill. ; 24 cmISBN:- 9780071455565
- 2005049594
- 621.381046 GIL
| Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|
| Anna Centenary Library | 621.381046 GIL (Browse shelf(Opens below)) | Available | 255835 |
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| 621.381046 BAL Foldable flex and thinned silicon multichip packaging technology | 621.381046 BAR Ceramic interconnect technology handbook | 621.381046 CHU Materials for electronic packaging | 621.381046 GIL MEMS/MOEMS packaging : concepts, designs, materials, and processes | 621.381046 GRE Hermeticity of electronic packages | 621.381046 HAR Electronic packaging and interconnection handbook | 621.381046 IMA Proceedings : IMAPS conference and exhibition on ceramic interconnect technology, the next generation : April 7-9 2003, the Westin Hotel, Denver, Colorado |
Includes bibliographical references and index
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