Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media

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Publication details: Bellingham, WA SPIE c2001Description: x, 380 p. : ill. ; 28 cmISBN:

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Current library	Call number	Status	Date due	Barcode
Anna Centenary Library	621.381046 SPI (Browse shelf(Opens below))	Available		424722

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Includes bibliographical references and index

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