Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales Jianfeng Luo, David Dornfeld

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Publication details: Berlin ; New York Springer 2004Description: xxiv, 311 pISBN:

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Current library	Call number	Status	Date due	Barcode
Anna Centenary Library	621.3815 DOR (Browse shelf(Opens below))	Available		208879

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Previous	621.3815 CUT Electronic circuits for the evil genius : 64 lessons with projects	621.3815 DAV Random testing of digital circuits : theory and applications	621.3815 DIF Electronic devices : systems and applications	621.3815 DOR Integrated modeling of chemical mechanical planarization for sub-micron IC fabrication : from particle scale to feature, die and wafer scales	621.3815 DUF Analog test signal generation using periodic [sigma delta]-encoded data streams	621.3815 DUR A practical guide to analog behavioral modeling for IC system design	621.3815 EDL Timing analysis and simulation for signal integrity engineers	Next

Includes bibliographical references and index

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