Fundamentals of lead-free solder interconnect technology : from microstructures to reliability by Tae-Kyu Lee ... [et al.]

By:

Contributor(s):

Publication details: Berlin Springer 2014Description: xiii, 253 p. : ill. (some color) ; 25 cmISBN:

ISSN:

Subject(s):

DDC classification:

Item type: Books

Tags from this library: No tags from this library for this title.

Average rating: 0.0 (0 votes)

Holdings
Current library	Call number	Status	Date due	Barcode
Anna Centenary Library	621.381 LEE (Browse shelf(Opens below))	Available		584570

Previous								Next
Previous	621.381 KYB All new electronics self-teaching guide	621.381 LAL Microelectronics : micro and nano-electronics and photonics	621.381 LAU Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials	621.381 LEE Fundamentals of lead-free solder interconnect technology : from microstructures to reliability	621.381 LEV Electronic ceramics : properties, devices, and applications	621.381 LIC Coating materials for electronic applications : polymers, processes, reliability, testing	621.381 LIC Adhesives technology for electronic applications : materials, processes, reliability	Next

There are no comments on this title.

to post a comment.

Find us on the map