Foldable flex and thinned silicon multichip packaging technology edited by John W. Balde

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Publication details: Dordrecht ; Boston Kluwer Academic Publishers 2003Description: xix, 338 p. : ill. ; 25 cmISBN:

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Item type: Books

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Current library	Call number	Status	Date due	Barcode
Anna Centenary Library	621.381046 BAL (Browse shelf(Opens below))	Available		262917

Includes bibliographical references and index

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