Fatigue life prediction of solder joints in electronic packages with ANSYS Erdogan Madenci, Ibrahim Guven, Bahattin Kilic

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Publication details: Dordrecht ; Boston Kluwer Academic Publishers 2002Description: xx, 185 p. : ill. ; 25 cmISBN:

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Current library	Call number	Status	Date due	Barcode
Anna Centenary Library	621.381046 MAD (Browse shelf(Opens below))	Available		300519

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Previous	621.381046 LAL Influence of temperature on microelectronics and system reliability	621.381046 LAU Advanced MEMS packaging	621.381046 LEE Manufacturing challenges in electronic packaging	621.381046 MAD Fatigue life prediction of solder joints in electronic packages with ANSYS	621.381046 MAR High-frequency characterization of electronic packaging	621.381046 MCK Mechanical analysis of electronic packaging systems	621.381046 MON Package electrical modeling, thermal modeling, and processing for GAAS wireless applications	Next

Includes bibliographical references and index

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