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Failure modes and mechanisms in electronic packages Puligandla Viswanadham and Pratap Singh
Publication details: London Chapman & Hall 1998Description: xx, 370 p. : ill. ; 24 cmISBN:- 9780412105913
- 97026388
- 621.381046 VIS
| Current library | Call number | Status | Date due | Barcode | |
|---|---|---|---|---|---|
| Anna Centenary Library | 621.381046 VIS (Browse shelf(Opens below)) | Available | 262911 |
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| 621.381046 TOM Quantum-well laser array packaging : nanoscale packaging techniques | 621.381046 TUM Microelectronics packaging handbook : subsystem packaging | 621.381046 TUM Electronic packaging for high reliability ; low cost electronics | 621.381046 VIS Failure modes and mechanisms in electronic packages | 621.381046 ZOH Heat convection in micro ducts | 621.381046 ZOR Multi-chip module test strategies | 621.38105 PRE Electronics and communication engineering: Sakthi's TRB guide |
Includes bibliographical references and index
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