Microelectronics packaging handbook : subsystem packaging edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein

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Publication details: Dordrecht ; Boston Kluwer Academic Publishers 1997Edition: 2nd edDescription: 3 v. : ill. ; 24 cmISBN:

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Current library	Call number	Status	Date due	Barcode
Anna Centenary Library	621.381046 TUM (Browse shelf(Opens below))	Available		304126

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