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Fatigue life prediction of solder joints in electronic packages with ANSYS (Record no. 182114)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00972nam a2200277Ia 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 191130s2002##################000#0#eng## |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 9781402073304 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 MAD |
| 100 ## - MAIN ENTRY--AUTHOR NAME | |
| Personal name | Madenci, Erdogan |
| 245 ## - TITLE STATEMENT | |
| Title | Fatigue life prediction of solder joints in electronic packages with ANSYS |
| Statement of responsibility, etc | Erdogan Madenci, Ibrahim Guven, Bahattin Kilic |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | Dordrecht ; Boston |
| Name of publisher | Kluwer Academic Publishers |
| Year of publication | 2002 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Number of Pages | xx, 185 p. : ill. ; 25 cm |
| 500 ## - GENERAL NOTE | |
| General note | Includes bibliographical references and index |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical Term | ANSYS (Computer system) |
| Topical Term | Electronic packaging - Computer-aided design |
| Topical Term | Metals - Fatigue |
| Topical Term | Service life (Engineering) - Forecasting |
| Topical Term | Solder and soldering - Quality control |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Guven, Ibrahim |
| Personal name | Kilic, Bahattin |
| 991 ## - | |
| -- | 147323 |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Date acquired | Full call number | Accession Number | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|
| Anna Centenary Library | Anna Centenary Library | 13.10.2020 | 621.381046 MAD | 300519 | 13.10.2020 | English Books |