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Wire bonding in microelectronics

Harman, George G

Wire bonding in microelectronics George G. Harmon - 3rd ed - New York McGraw-Hill 2010 - xx, 426 p. : ill. ; 24 cm

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989

ISBN: 9780071476232

ISSN: 2010287045

Subjects--Topical Terms:
Electronic packaging - Defects
Electronic packaging - Reliability
Semiconductors - Failures
Wire bonding (Electronic packaging) - Production control

Dewey Class. No.: 621.3815 HAR

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