Normal view MARC view ISBD view

Reliability, Packaging, Testing, And Characterization Of Mems/moems Vi : 23-24 January, 2007, San Jose, California, Usa

Hartzell, Allyson L. ; Ramesham, Rajeshuni

Reliability, Packaging, Testing, And Characterization Of Mems/moems Vi : 23-24 January, 2007, San Jose, California, Usa / edited by Allyson L. Hartzell, Rajeshuni Ramesham - 1st ed. - Bellingham Spie c2007 - ix, (various pagings) : ill. ; 29 cm. - Proceedings of SPIE--the International Society for Optical Engineering, v. 6463 .

Includes index

ISBN: 9780819465764

Subjects--Topical Terms:
Microelectromechanical Systems Reliability Congresses
Microelectronic packaging

Dewey Class. No.: 621.381 / HAR

Print
Cite
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)

Reliability, Packaging, Testing, And Characterization Of Mems/moems Vi : 23-24 January, 2007, San Jose, California, Usa

Find us on the map