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Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California

Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California sponsored by IMAPS--International Microelectronics and Packaging Society [and] CMP Media - Bellingham, WA SPIE c2001 - x, 380 p. : ill. ; 28 cm

Includes bibliographical references and index

ISBN: 9780819441393

ISSN: 2002277508

Subjects--Topical Terms:
Integrated circuits - Design and construction - Congresses
Microelectromechanical systems - Congresses
Microelectronic packaging - Congresses

Dewey Class. No.: 621.381046 SPI

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Proceedings : 2001 HD international conference on high-density interconnect and systems packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California

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