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Advanced MEMS packaging

Lau, John H

Advanced MEMS packaging John H. Lau ... [et al.] - New York McGraw Hill c2010 - xxiii, 552 p. : ill. ; 24 cm

Includes bibliographical references and index

ISBN: 9780071626231

ISSN: 2009040456

Subjects--Topical Terms:
Microelectromechanical systems
Microelectronic packaging

Dewey Class. No.: 621.381046 LAU

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