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Fatigue life prediction of solder joints in electronic packages with ANSYS

Madenci, Erdogan

Fatigue life prediction of solder joints in electronic packages with ANSYS Erdogan Madenci, Ibrahim Guven, Bahattin Kilic - Dordrecht ; Boston Kluwer Academic Publishers 2002 - xx, 185 p. : ill. ; 25 cm

Includes bibliographical references and index

ISBN: 9781402073304

ISSN: 2002038928

Subjects--Topical Terms:
ANSYS (Computer system)
Electronic packaging - Computer-aided design
Metals - Fatigue
Service life (Engineering) - Forecasting
Solder and soldering - Quality control

Dewey Class. No.: 621.381046 MAD

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Fatigue life prediction of solder joints in electronic packages with ANSYS

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