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Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France

Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France Bernard Courtois ... [et al.] chairs/editors ; sponsored by CNRS-INPG-UJF (France) ... [et al.] - Bellingham, Wash SPIE c2002 - xvii, 832 p. : ill. ; 28 cm

Includes bibliographical references and index

ISBN: 9780819445186

ISSN: 2002510518

Subjects--Topical Terms:
Microelectromechanical systems - Congresses
Microelectronic packaging - Congresses
Micromachining - Congresses
Optoelectronic devices - Congresses

Dewey Class. No.: 621.38173 COU

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Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France

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