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Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses : fundamental mechanisms and application to IC interconnect technology

Borst, Christopher L

Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses : fundamental mechanisms and application to IC interconnect technology by Christopher L. Borst, William N. Gill, Ronald J. Gutmann - Deventer, The Netherlands ; Boston, MA Kluwer Academic Publishers 2002 - xiv, 229 p. : ill. ; 25 cm

Includes bibliographical references and index

ISBN: 9781402071935

ISSN: 2002028782

Subjects--Topical Terms:
Chemical mechanical planarization
Grinding and polishing
Interconnects (Integrated circuit technology)
Semiconductors - Polishing

Dewey Class. No.: 621.38152 BOR

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Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses : fundamental mechanisms and application to IC interconnect technology

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