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Microelectronics packaging handbook : subsystem packaging

Microelectronics packaging handbook : subsystem packaging edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein - 2nd ed - Dordrecht ; Boston Kluwer Academic Publishers 1997 - 3 v. : ill. ; 24 cm

Includes bibliographical references and index

ISBN: 9780412084515

ISSN: 96037907

Subjects--Topical Terms:
Microelectronic packaging - Handbooks, manuals, etc

Dewey Class. No.: 621.381046 TUM

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